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| Micro-Cam™ |
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Infrared Camera System
for Very Low Background Instrumentation
Camera Components
The camera consists the following components:
- Focal Plane Array (FPA): Detector array integrated with Read out integrated circuit (ROIC) in a hybrid unit
- Dewar: LN2 pour filled dewar with no internal optics, other than a limiting cold aperture defining the F/# and a AR coated sapphire entrance window
- Orientation: Available in Sideward looking, Downward looking or Upward looking options
- LN2 Cooling System: Includes dewar interface bulb, hoses and tank valve
- Control Electronics: Provide all clocking and biases to the FPA and digitizing array in multiple video taps at selected pixel rates
- Cables: Data, Communication and Power
- Temperature sensor/control electronics: Internally mounted temperature sensor and heater
Available Options
- Power supply
- Image acquisition system
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Upward looking MicroCam. |
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Specifications
| Parameters |
Description |
| FPA format |
256x256 with 40 micron pixel pitch (PICNIC ROIC).
640x512 or 1016x1016 with 18 micron pixel pitch (HAWAII ROIC). |
| Detector material |
Silicon for visible band from 400 nm to 1.0 mm.
InGaAs for NIR from 900 to 1600 nm.
HgCdTe for SWIR to MWIR from 900 nm to 5.0 mm. |
| Mean QE |
Wavelength, AR coating and temperature dependent. >80% peak QE achievable. |
| Frame rate |
Range from 1Hz to >60 Hz, depending on FPA array size, clock speed and ROIC type. |
| Mean dark current |
Detector material and temperature dependent. (e.g. < 2e- for HgCdTe at 77K ). |
| Total Noise per frame |
ROIC dependent (e.g. < 20 e- for HAWAII ROIC achievable ). |
| Mean well capacity |
>80,000 e- depending on system gain. |
| Response operability |
≥98% |
| Integration and triggering |
Can be triggered by TTL compatible input signal. Integration time will be Pattern Generator register entry controlled by customer. |
| Windowing mode |
ROIC type dependent |
| Electrical interface |
16-bit data digitization with either CameraLink or AIA 16 bit RS422 w/ RS232 differential serial link, electrically isolated from camera electronics. |
Published Information – Cleared for Public Release by the DoD’s Office of Security Review, Case 08-S-0802
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